C12200-321X-ray TDI camera

c12200-321 product photo

Catalog [1 MB/PDF]

X-ray TDI camera C12200-321 is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution.

Features

・High speed readout: 36.8 m/min.
・Detection area: 221.1 mm
・Horizontal spatial resolution: 4608 pixels
・High S/N ratio with 12 bit output
・Camera Link Interface (Base Configuration)
・Single power supply (+15 V) operation
・Real time dark current/shading correction function
・Frame readout mode for easy installation alignment

c12200-321 product feature

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Principle

c12200-321 principle

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Applications

  • Printed circuit board (PCB) inspection
  • Surface-mounted component inspection
  • Battery inspection
  • High-resolution in-line non-destructive inspection

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Measurement examples

Void inspection of BGAs

c12200-321 measurement examples

X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area.
S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence.
Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation.

c12200-321 measurement examples

 

Inspection of a solder's back fillet

If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software.

c12200-321 measurement examples

 

Lithium-ion battery inspection

In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping.

c12200-321 measurement examples

c12300-321 measurement examples

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Specifications

Type number C12200-321
Scintillator FOS (Fiber optic plate with scintillator)
Recommended use range Approx. 25 kV to 90 kV*1
Number of pixels 4608 (H)×110 (V)
Cell size 48 μm×48 μm
X-ray sensitive area 221.1 mm (H)×5.2 mm (V)
Line speed 2.88 m/min to 23.04 m/min
CCD pixel clock 5.0 MHz
TDI line rate 1×1: Max. 8.0 kHz (23.04 m/min)
binning 2×2: Max. 6.4 kHz (36.864 m/min)
A/D converter 12 bit
External control interface Camera Link Base Configuration
Pixel clock 40 MHz (Camera Link)
Power supply DC+15 V
Power consumption Approx. 40 VA
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.

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Dead space between chips

C12200-321 has a following dead space between chips.

 c12200-321 product feature

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Dimensions

c12200-321 dimensional outline

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Disclaimer
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