LCOS-SLM (Optical phase modulator)

X15223-03CR

Our proprietary thermal design technology realizes the special light modulator with high power handling capability (Sapphire type: 1050 ± 50 nm)

The X15223-03CR is an LCOS-SLM designed to be installed in devices. The LCOS-SLM head and driver circuit are connected with a flexible cable and can be easily installed in devices. Generally, when a LCOS-SLM is irradiated with a high power laser, the temperature of the LC layer increases, reducing the performance of LCOS-SLM. Therefore, in order to enhance power handling capability, it is necessary to improve the heat dissipation efficiency and suppress the temperature rise of the LC layer. By applying our proprietary thermal design technology to enhance heat dissipation efficiency, this product has achieved high power handling capability of 700 W or more, which is 3.5 times higher than the conventional product (water-cooled type: X15223-03BR). It can be applied to metal 3D printing, where metal powder is sintered by laser, and to laser metal welding and cutting. 

Principle of improving the power handling capability

The X15223-03CR uses a sapphire glass as a cover glass. Since the thermal conductivity of sapphire is approximately 30 times higher than that of quartz glass, the heat generated in the LC layer is easily transferred to the cover glass. Furthermore, by enclosing a filler with high thermal conductivity inside the LCOS-SLM head package and optimizing the internal structure, the generated heat can be quickly transmitted from the sapphire glass to the water-cooled heat sink via the filler. These improvements suppress heat-induced characteristic changes and material destruction, and enhance power handling capability.

X15223-03CR

Existing type

Characteristics

Phase modulation characteristics

Almost ideal phase modulation characteristics can be obtained even when irradiated with high power lasers exceeding 700 W.

Please contact us for details, as it depends on the laser irradiation conditions and water cooling conditions.

Video

Specifications

Pixel pitch 12.5 μm
Input signal DVI-D / USB-B (2.0 High-speed)
DVI signal format SXGA (1280 x 1024 pixels)
DVI frame rate 60 Hz
Number of input levels 256 (8 bits) levels
Number of pixel 1272 × 1024 pixels
Effective area 15.9 x 12.8 mm
Fill factor 96.8 %
Rise time 27 ms
Fall time 83 ms
Readout light wavelength 1050 ± 50 nm
Light utilization efficiency 97 %
Measurement condition λ=1064 nm

Contact us for more information.

  • Literature
  • Price
  • Delivery
  • Custom order
  • Support
  • Other

Contact us