C12300-321X-ray TDI camera

c12300-321 product photo

Catalog [1 MB/PDF]

X-ray TDI camera is useful for in-line applications requiring high-speed operation, high sensitivity and high resolution with wide area.
C12300-321 is drastically improved the line speed up to 86.4 m/min. With bidirectional scanning operation, it enables to capture the objects effectively and improves the machine cycle time.

Features

・High speed readout (20 kHz)
・Bidirectional scanning operation
・Improving radiation hardness
・High S/N ratio with 12 bit output
・Camera Link interface (Base configuration)
・Single power supply (+15 V) operation
・Real time dark current/shading correction function
・Frame readout mode for easy installation alignment

c12300-321 product feature

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Principle

c12300-321 principle

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Bidirectional scanning operation is supported

C12300-321 enables for the bidirectional scanning (inverse direction scanning) operation. It is useful when the scanning direction is different in the same inspection system or the rescanning is needed for NG judgement.
Also the machine cycle time can be improved for large objects such as PCBs.

c12300-321 product feature

 

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Applications

  • Printed circuit board (PCB) inspection
  • Surface-mounted component inspection
  • Battery inspection
  • High-resolution in-line non-destructive inspection

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Measurement examples

Void inspection of BGAs(Ball Grid Array)

c12300-321 measurement examples

X-ray TDI camera can inspect the samples easily by high speed scan with narrow irradiate area.
S/N ratio is one of advantage and low X-ray radiation is enough to inspect the void existence.
Furthermore it contribute to make a smaller size of system by reducing a lot of X-ray irradiation.

c12300-321 measurement examples

 

Inspection of a solder's back fillet

If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software.

c12300-321 measurement examples

 

Lithium-ion battery inspection

In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping.

c12300-321 measurement examples

c12300-321 measurement examples

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Specifications

Type number C12300-321
Scintillator FOS (Fiber optic plate with scintillator)
Recommended use range Approx. 25 kV to 130 kV*1
Number of pixels 4608 (H)×150 (V)
Cell size 48 μm×48 μm
X-ray sensitive area 221.1 mm (H)×7.2 mm (V)
Line speed 0.576 m/min to 57.6 m/min
CCD pixel clock 10.0 MHz
TDI line rate 1×1: Max. 20.0 kHz (57.6 m/min)
binning 2×2: Max. 15.0 kHz (386.4 m/min)
A/D converter 12 bit
External control interface Camera Link Base Configuration
Pixel clock 48 MHz (Camera Link)
Power supply DC+15 V
Power consumption Approx. 45 VA
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.

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Dead space between chips

C12300-321 has a following dead space between chips.

c12300-321 product feature

 

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Dimensions

c12300-321 dimensional outline

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Disclaimer
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