C10650-321X-ray TDI camera

c10650-321 product photo

Catalog [972 KB/PDF]

X-ray TDI camera C10650-321 is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution.

Features

・High speed readout: 10.7 m/min.
・Detection area: 221.1 mm
・Horizontal spatial resolution: 4608 pixels
・High S/N ratio with 12 bit output
・Camera Link interface (Base Configuration)
・Single power supply (+15 V) operation
・Real time dark current/shading correction function
・Frame readout mode for easy installation alignment


c10650-321 product feature

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Principle

c10650-321 principle

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Applications

  • Printed circuit board (PCB) inspection
  • Surface-mounted component inspection
  • Lithium-ion battery inspection
  • High-resolution in-line non-destructive inspection

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Measurement examples

Inspection of a solder's back fillet

If the back fillet of the solder on a PCB has a defect, a connection error will occur even with small vibrations. For observation of the back fillet part, X-ray transmission technique has been applied but only with an off-line system. Our X-ray TDI camera realizes in-line inspection because it can acquire high speed profile data with high sensitivity. 3D brightness level can be displayed using software.

c10650-321 application example

 

Lithium-ion battery inspection

In case of 2D sensor, the dimensional measurement cannot be implemented correctly because the image is distorted on the corner areas of the X-ray irradiation. The long length sample needs to be located on center of X-ray source, so the sample has to be relocated each time. X-ray TDI camera can capture the image with no distortion by line scan method, so it is not necessary to relocate the samples and it enables the continuous inspection for long length object without stopping.

c10650-321 application example

c10650-321 application example

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Specifications

Type number C10650-321
Scintillator FOS (Fiber optic plate with scintillator)
Recommended use range Approx. 25 kV to 90 kV*1
Number of pixels 4608 (H)×128 (V)
Cell size 48 μm×48 μm
X-ray sensitive area 221.1 mm (H)×6.1 mm (V)
Line speed 0.178 m/min to 6.073 m/min
CCD pixel clock 4.0 MHz
TDI line rate 1×1: Max. 2.109 kHz (6.073 m/min)
Binning 2×2: Max. 1.858 kHz (10.702 m/min)
A/D converter 12 bit
External control interface Camera Link Base Configuration
Pixel clock 16.0 MHz (Camera Link)
Power supply DC+15 V
Power consumption Approx. 30 VA
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.

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Dimensions

c10650-321 dimensional outline

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Dead space between chips

Standard type has a following dead space between chips.

c10650-321 product feature

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Disclaimer
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