We introduce the devices for semiconductor manufacturing/inspection equipment and the special semiconductor systems that do failure analysis of an inside of VLSI, inspection of electrodes, film thickness measurement, wafer thickness measurement, plasma-process monitor.

Device products

For camera for inspection

k_a034_x-ray_analyzar.jpg

Devices for camera for inspection.

For plasma process

Devices for Plasma Process.

For wafer inspection

Devices for Wafer inspection.

For wafer dicing

New wafer dicing technology.

For exposure instrument

Devices for Exposure instrument.

For X-ray product inspection

Devices for X-ray product inspection.

System products

Failure analysis

Failure analysis

Semiconductor failure analysis systems to locate, visualize and analyze failures inside semiconductor devices by detecting weak light emissions, heat emissions or electrical changes by induced light beam.

Dynamic timing analysis

Dynamic timing analysis

Semiconductor failure analysis systems for verification of list design and its operation and locating and analyzing a transistor causing a failure by analyzing operation time of LSI.

OBIRCH analysis

OBIRCH analysis

Semiconductor failure analysis systems utilizing IR-OBIRCH method that detects the electrical changes caused by heat generated by an infrared laser beam.

Thermal analysis

Thermal analysis

Semiconductor failure analysis systems to detect and locate thermal signal generated by failures such as short circuit, abnormality of contact holes, microplasma leakage in oxide layer and oxide layer breakdown.

Film thickness measurement

Film thickness measurement

Non-contact high precision membrane thickness measurement systems utilizing optical method.

Wafer thickness measurement

Wafer thickness measurement

Non-contact high precision membrane thickness measurement systems of semiconductor wafer utilizing optical method.

Plasma measurement

Plasma-process monitor

Monitoring systems for the plasma emissions in real time, and the camera systems to measurement of plasma utilizing the high speed gate operation.

Go to top

Disclaimer
 [66KB/PDF]

The save-to-list function can only work if JavaScript is turned on.

The recently viewed function can only work if JavaScript is turned on.