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ホログラフィックレーザ加工
空間光変調器とホログラム
位相を空間的に制御することで、光の回折や干渉現象を制御できるようになり、高い光の利用効率をもって任意の光強度分布を形成することができます。このような任意の光強度分布をLCOS-SLMで生成するための位相分布を、計算により算出することができます。これを計算機生成ホログラム（Computer Generated Hologram; CGH）と呼び、コンピュータにより簡単に計算させることができます。光の透過・遮断によって光の強度を調整する一般的な投影プロジェクタと比較して、CGHを用いたホログラフィックビーム成型技術は光の干渉効果を巧みに利用する技法であるため、光をロスすることなく高効率でビームを成型することができます。この技術は、特に入射光強度の強いレーザ加工において効果を発揮します。一般的な投影プロジェクタでは、光を遮断した部位では熱に変換されてしまうことも多く、加工機の寿命に直結することがあります。ホログラフィックビーム成型ではその影響が小さいため、高強度の光を利用することができるようになります。また、レンズなどで集光した光を複数ビームに分割することができるため、高精度かつ高スループットな加工も実現でき、製造業における生産性を質的に変革させるシステムの構築も期待されます。
製造ラインを変える全自動レーザマーキング
赤色レーザの位置を高速度カメラで捉え、その位置情報を基に計算されたホログラムを空間光変調器に表示することで、緑色レーザで生成したパターンを赤色レーザ上に表示することができます。曲面形状を持つ加工対象がさまざまな向きで製造ラインを流れてきたとき、これらを高速に捕捉・特長量を抽出し、フィードバックをかけることで、適切な向きや位置にレーザマーキングできる装置の開発が期待されます。
イメージ図：製造ラインを流れてくる物体に、マーキング用レーザを適切に照射
LCOS-SLMと高速センシングの融合 ～レーザトラッキング～
ステルスダイシングとその高精度化
ステルスダイシング™プロセスは、パルスレーザを用いて、ウエハ内部に加工を施すことで高品質に分割するダイシング方法です。半導体製造において、ウエハはサイズ的には大型化をたどる一方で、その厚さは非常に薄型となってきています。このような1枚のウエハからいかにロスなく多くのデバイスを切り出せるか、あるいは高機能を有した集積回路をいかに傷付けずに切り出せるか、ダイシング工程は最終製品が小型・高性能になればなるほど過酷な条件を課せられます。この技術は、ウエハ内の1点にレーザ光を高精度に集光させることが亀裂を伸ばすために必要になります。しかし、一般的なウエハ材料であるシリコンは屈折率が高いため、集光途中に空気とシリコン材料の界面が存在すると、そこで発生する球面収差によってレーザ集光特性が劣化します。そのためLCOS-SLMを搭載することで、球面収差を補正させることができるようになり、さらにウエハ材料が変わっても同様の補正が実現できるようになります。
レーザ加工応用に向けた高性能化
ホログラフィックビーム成形は、高精度かつ高スループットな加工を実現する空間光制御技術の実用化や、製造業における生産性を質的に変革させる製造システムの構築に貢献できると考えられており、非常に研究開発が盛んな分野になります。一方で、LCOS-SLMは液晶とCMOS技術を用いた高性能なデバイスであるため、高い平均出力をもつ加工用レーザの利用に長期間十分耐えることが望まれています。そのため当社はLCOS-SLM自体の高性能化（大面積化、紫外光対応、高速化、高集積化）、およびそれを用いた加工と計測を一体化した高精度レーザ加工モジュールの実用化を目指しています。
これを実現するために、国立研究開発法人量子科学技術研究開発機構が管理法人をつとめる、SIP（戦略的イノベーション創造プログラム）第２期課題「光・量子を活用したSociety5.0実現化技術」に採択されました。SIPは、総合科学技術・イノベーション会議が府省・分野の枠を超えて自ら予算を配分し、基礎研究から出口（実用化・事業化）までを見据えた取組を推進するものです。本課題「光・量子を活用したSociety5.0実現化技術」では、サイバーフィジカルシステム(CPS)の構築がSociety 5.0 実現の鍵である一方、Society 5.0 実現に向けた投資を阻むボトルネックが存在していることから、我が国が強みを有する光・量子技術を活用し、これらのボトルネックを解消可能な重要技術を厳選・開発します。当社は、研究課題「空間光制御技術に係る研究開発」に採択され、高精度・高スループットレーザ加工のための空間光制御技術開発を実施しています。
■内閣府の戦略的イノベーション創造プログラム（SIP）の関連HP
参考文献
- E. Ohmura et al., "Internal modified-layer formation mechanism into silicon with nanosecond laser", Journal of Achievements in Materials and Manufacturing Engineering 17, 381(2006).
- M. Kumagai et al., "Advanced Dicing Technology for Semiconductor Wafer - Stealth Dicing", IEEE Transactions on Semiconductor Manufacturing 20, 259(2007).
- E. Ohmura et al., "Analysis of Processing Mechanism in Stealth Dicing for Ultra Thin Silicon Wafer", Journal of Advanced Mechanical System Design, Systems, and Manufacturing 2(4), 540(2008).
- Yu Takiguchi, Taro Ando, Yoshiyuki Ohtake, Takashi Inoue, Haruyoshi Toyoda, “Effects of dielectric planar interface on tight focusing coherent beam: direct comparison between observations and vectorial calculation of lateral focal patterns”, Journal of the Optical Society of America A 12/2013; 30(12):2605-10.
- Yu Takiguchi, Masaki Oyaizu, Makoto Nakano, Takashi Inoue, Haruyoshi Toyoda, "Suppression of backside damage in nanosecond internal-focusing pulse laser dicing with wavefront modulation," Optical Engineering 56(7), 077109 (2017)
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