Hamamatsu, Japan – October 15, 2007 – Hamamatsu Photonics K.K. has formed a business tie-up with DISCO Corporation (head office: Ota-ku, Tokyo; President: Hitoshi Mizorogi) as a supply partner for Hamamatsu Photonics' Stealth Dicing Engine (SDE).
In recent years, there has been a remarkable convergence in the wafer dicing needs of manufacturers of memory chips, MEMS and other semiconductor devices, and the characteristics of Stealth Dicing technology. Hamamatsu Photonics aims to make this technology more widely available by expanding the number of suppliers of its SDE. As the newest
supply partner of Hamamatsu Photonics in this market, DISCO Corporation will begin accepting orders for the SDE and help bring Stealth Dicing technology to more manufacturers.
