Hamamatsu, Japan – January 21, 2010 – Hamamatsu Photonics K.K. has developed its own MEMS-based flip chip packaging technology for creating heterojunction optoelectronic devices such as compound semiconductor photodiode arrays that are bump-bonded to silicon CMOS signal processing circuitry. The first commercial products to come from this new packaging technology will be high-performance, infrared-sensitive InGaAs image sensors that are more compact and less expensive than conventional InGaAs image sensors.
Sample deliveries of the new InGaAs image sensors are scheduled to begin
in April. The products will be available to Japan-based and international manufacturers of measurement and analytical instruments.
From January 26 to 28, Hamamatsu will exhibit the new InGaAs image sensors at the SPIE Photonics West event (San Francisco, CA). Please visit booth 1413 for more information.
