Stealth dicing engine

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Stealth dicing technology: L9570-01

In stealth dicing, a laser beam at a wavelength capable of transmitting through the material is condensed on an internal point in that material. This selectively forms a mechanical damage layer (stress layer) in a localized point near the light focus area so that the material is cut from the "inside". The operating principle of stealth dicing is fundamentally different from conventional blade dicing technology that cuts the material from the "outside".

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