Stealth Dicing™ technology
In Stealth Dicing™ Process, a laser beam at a wavelength capable of transmitting through the material is condensed on an internal point in that material. This selectively forms a mechanical damage layer (stress layer) in a localized point near the light focus area so that the material is cut from the "inside". The operating principle of Stealth Dicing™ Process is fundamentally different from conventional blade dicing technology that cuts the material from the "outside".
Explanation of Stealth Dicing™ Technology.
Our business associates, “SD Alliance Partners”, are system integrators that have been granted comprehensive licensing on the patent portfolio for our Stealth Dicing™ technology.
Our patent portfolio consists of a total of some 600 patent cases, including approximately 160 Japanese patents, 110 US patents, 70 Korean patents, 60 Taiwanese patents and 90 Chinese patents, as well as inventions relating to the Stealth Dicing™ technology that are patent pending in a number of countries. We have comprehensively licensed this patent portfolio to a plurality of SD Alliance Partners, in the form of OEM supplies for Stealth Dicing™ engines. This license includes the manufacturing processes for semiconductor products, LEDs and other devices.
We recommend using the laser dicing equipment produced by an SD Alliance Partner as listed below on this Web page for the manufacturing of semiconductor products, LEDs and other devices employing the Stealth Dicing™ technology. Implementing a manufacturing process that falls within the scope of any one of the rights included in our patent portfolio by using laser dicing equipment produced by a Non-Licensee System Integrator (a system integrator other than one of our SD Alliance Partners) will constitute patent infringement, which is considered an illegal act.
Please bear in mind that a laser dicing equipment produced by a Non-Licensee System Integrator induces illegal acts by the end user in using said laser dicing equipment. Please contact us if you are not sure whether a manufacturer of laser dicing equipment has been granted the comprehensive license of our patent portfolio. With respect to the Stealth Dicing™ technology, our license agreements with SD Alliance Partners are in a non-exclusive form.
The partnership relationship with TOKYO SEIMITSU CO., LTD. has ended on September 18, 2017.
We are launching a website to release technical information on our Stealth Dicing™ (SD) technology (both in Japanese and English). Also starting up is a website service limited to Stealth Dicing™ equipment users, which provides useful information about laser processing "recipes" ideal for dicing various types of semiconductor wafer devices.
This service allows Stealth Dicing™ equipment users to easily find a new processing recipe which will be needed when dicing new wafer devices. This therefore helps to streamline the operator's task of creating new processing recipes. We also have a database that holds lots of technical know-how on laser processing we have acquired while developing the Stealth Dicing™ technology. This dedicated website service gives processing recipes that are an ideal match for many types of semiconductor devices in terms of wafer thickness, structure and chip size, etc.
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