Semiconductor manufacturing related system Semiconductor manufacturing related system

Semiconductor manufacturing support systems

This system is a monitoring system to detect wide spectrum plasma emission during the process of etching, spattering and CVD in semiconductor manufacturing.

Stealth Dicing™ Process is the next generation of dicing technology. While conventional blade dicing cuts the material from the outside, our Stealth Dicing™ engines cut from the inside by focusing a laser beam on an internal point of the material being diced.

This is the quick inspection system for the quality of micro LED chips on a wafer by using pattern images and photoluminescence (PL) images.

Imaging systems for localizing low light photoemission and thermal signal emitting semiconductor failures.

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