Si photodiode

S13956-01

Back-illuminated photodiodes with CSP structure

A scintillator can be coupled directly on the chip by using a back-illuminated photodiode. It is designed with minimal dead space around the product. This makes it possible to arrange multiple products side by side.


Features
-Spectral response range: 400 to 1100 nm
-Package size: 3 × 3 mm
-Easy coupling to scintillator
-Easy coupling with a scintillator
  Because there are no wires in the photosensitive area and the optical coupling efficiency with an scintillator can be maximized, it suitable for non-destructive X-ray inspection equipment.

Notice

The chip of this product is not sealed and is exposed. Parts such as electrodes on the chip are not protected by an enclosure or window and so require especially strict care during handling compared to ordinary products.
Before using this product, always read “Unsealed products / Precautions” described below.

Unsealed products / Precautions [PDF]

Specifications

Photosensitive area 2.5 × 2.5 mm
Number of elements 1
Package Glass epoxy
Package category CSP
Cooling Non-cooled
Reverse voltage (max.) 10 V
Spectral response range 400 to 1100 nm
Peak sensitivity wavelength (typ.) 960 nm
Photosensitivity (typ.) 0.61 A/W
Dark current (max.) 300 pA
Rise time (typ.) 15 μs
Terminal capacitance (typ.) 60 pF
Measurement condition Typ. Ta=25 ℃, Photosensitivity: λ=920 nm, Dark current: VR=10 mV, Terminal capacitance: VR=0 V, f=10 kH, unless otherwise noted

Spectral response

Dimensional outline (unit: mm)

Related documents

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