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iPHEMOS®-DDX Inverted emission microscope
C18040-11
Dock to the Tester. Unlock the Failure.
iPHEMOS-DDX is an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, HBM, 2.5D/3D packages, and large-scale semiconductor packages. Its direct-docking configuration from three directions enables rapid setup of a tester-centric Electrical Failure Analysis (EFA) environment.
iPHEMOS is a registered trademark of Hamamatsu Photonics K.K. (Japan).
Features
Flexible docking structure
The system adopts a structure that enables direct docking to a tester from three directions, allowing rapid construction of a tester-centric EFA environment while improving layout flexibility and reducing setup time.
Advanced semiconductor package analysis
Failure locations can be identified while maintaining direct docking to a tester for advanced semiconductor packages utilizing AI chiplets, HBM stacks, interposers, and stacked-die architectures.
A high-stability design minimizes temperature drift and vibration under both ambient and cooled operating conditions, enabling stable, long-term analysis of large and thermally sensitive semiconductor packages.
Multi-application analysis platform
A platform integrating seven analytical techniques, including PEM, Thermal/LIT, LSM, OBIRCH, DALS, EOP/EOFM, and TD Imaging, enables the entire FA workflow to be performed on a single system.
*1 Solid Cold Emmi-X camera available. Please contact us regarding other platforms.
High accuracy stage designed for advanced devices
Working range of optical stage
| X | 60 mm |
|---|---|
| Y | 60 mm |
| Z | 20 mm |
* Working range might be narrower than these values due to the prober being used and interference with the sample stage or mounting of a NanoLens.
Basic display functions
Superimposed display/contrast enhancement function
* The actual display may differ depending on your software version, environment, etc.
The iPHEMOS-MPX superimposes the emission image on a high-resolution pattern image to localize defect points quickly.
The contrast enhancement function makes an image clearer and more detailed.
Display function
- Annotations: Comments, arrows, and other indicators can be displayed on an image at any location desired.
- Scale display: The scale width can be displayed on the image using segments.
- Grid display: Vertical and horizontal grid lines can be displayed on the image.
- Thumbnail display: Images can be stored and recalled as thumbnails, and image information such as stage coordinates can be displayed.
- Split screen display: Pattern images, emission images, superimposed images, and reference images can be displayed in a 6-window screen at once.
TD Imaging
TD Imaging(optional) is a new technology suitable for identifying defects in semiconductors with complex structures, such as logic semiconductors. It is available to pinpoint defects in semiconductors that contain metal parts internally.
Solid Cold Emmi-X camera
The Solid Cold Emmi-X camera is a photoemission analysis camera featuring Solid Cold cooling, a linear cooling mechanism. It offers higher stability and easier maintenance than LN₂-based systems. It combines a wide field of view with a high S/N sensor and high-speed wavelength switching to enable ultra-low-level emission detection. This allows efficient, high-uptime analysis of advanced logic and high-density memory devices.
Specifications
| Dimensions/Weights | Main unit: 1350 mm (W) × 950 mm (H) × 1350 mm (D)*1, Approx. 1620 kg Operation desk*3: 1000 mm (W) × 700 mm (H) × 800 mm (D), Approx. 39.2 kg (C16216-01 Operation desk) / 1480 mm (W) × 700 mm (H) × 800 mm (D), Approx. 48.6 kg (C16216-02 Operation desk) |
|---|---|
| Line voltage | Single phase 200 V to 240 V |
| Power consumption | Approx. 3300 VA |
| Compressed air*4 | 0.5 MPa to 0.7 MPa |
*1: Excluding joint sections
*2: Including signal tower
*3: Optional
*4: Regulator included
- Confirmation
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