Thickness measurement system

Comparison of measurement methods | Thickness measurement system

Comparison of measurement methods

  • Enables acquisition of in-plane film thickness distribution in just 5 seconds*1
  • Measurement points can be selected based on measurement results
  • No alignment or additional mechanisms required for measurement
  • Supports inline operation*2

*1 Approximate time for acquiring in-plane film thickness distribution of a 300 mm Si wafer.

*2 For more details, please contact us.

  • Supports a wide wavelength range
  • Capable of high-accuracy measurement even for multilayer structures
  • Compact design for easy integration into inline systems

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