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What are thickness measurement systems? | Thickness measurement system
Thickness measurement systems are specialized measurement instruments designed to accurately determine either the thickness of an object itself or the thickness of thin films formed on its surface. We offer two product series: Optical NanoGauge, optimized for thin-film measurements at the nanometer scale, and Optical MicroGauge, designed for thickness measurements ranging from micrometers to millimeters.
Hamamatsu Photonics provides solutions utilizing thickness measurement systems for film deposition monitoring and wafer thickness control in semiconductor device manufacturing processes.
Measurement principles of thickness measurement systems
Various measurement methods are available for evaluating thickness and film thickness, including:
- Electromagnetic method
- Eddy current method
- Ultrasonic method
- Spectral interferometry
- Laser interferometry
Hamamatsu Photonics specializes in optical techniques, particularly spectral interferometry and laser interferometry, and offers a comprehensive range of thickness measurement systems tailored to the thickness and material properties of the target objects.
Spectral interferometry
Multiple reflections occur inside the thin film as light enters a thin film sample. These multiple-reflection light waves boost or weaken each other along with their phase difference. The phase difference of each multiple-reflection light is determined by the light wavelength and optical path length. Therefore, the reflected or transmitted spectrum from the sample shows a specific spectrum determined by the film thickness.
Spectral interferometry is a technique for measuring film thickness by analyzing that particular spectrum. The Optical NanoGauge Thickness measurement system utilizes spectral interferometry to analyze a target spectrum by the curve-fitting or FFT (Fast Fourier Transform) method that matches your application.
Laser interferometry
The probe head irradiates the sample with near infrared light which reflects back from the front surface of the film. Some of the light transmits through the film and reflects back from the boundary on the opposite side. The controller internally processes each reflected light to detect the position on the film boundary where light was reflected. The controller then calculates the film thickness from the distance between the detected peaks.
For wafer with patterns
Measures wafer thickness without penetrating metal patterns
For bonded wafer
Measures the thickness of each wafer
- Confirmation
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