Applications | QPM optical module

Detection of semiconductor surface microparticles

As devices in the semiconductor market continue to be stacked and miniaturized, there is an increasing demand for microparticles and defects. The QPM optical module enables high-speed microparticles and defects on the wafer surface that are not visible by ordinary bright-field observation, and is expected to improve the yield of semiconductor devices.

1. Wafer surface of TEG

The image on the right shows a TEG (Test Element Group) wafer surface imaged by the QPM optical module. Since a high-definition image can be acquired, the uniformity of fine line width (1um wiring pattern width) can be seen even in a magnified image.

2. Semiconductor wafer surface (edge)

Nanometer scale bump-shape defects can be measured. By processing the images captured by the QPM optical module, cross-section profiles can also be obtained.

Nanometer scale bump-shape defects

励起光・バンド端発光・蛍光の同時測定結果

Profile of cross section A

Profile of cross section B

3. Observation of pit-shape defects on the surface of compound semiconductor wafers (comparison with bright-field observation images)

Nanometer scale pit-shape defects, which were difficult to detect with bright-field observation images, can be detected with the QPM optical module.

Observation image using QPM optical module

励起光・バンド端発光・蛍光の同時測定結果

Bright-field observation image

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