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Semiconductor manufacturing
Semiconductor manufacturing process (front-end process)
Wafer grinding
Explore the critical monitoring technologies Hamamatsu offers for semiconductor manufacturing, including precision in wafer grinding, thickness measurement, and advanced cleaning technologies. These solutions are designed to meet the stringent requirements of the semiconductor industry, ensuring optimal equipment performance and cleanliness.
Circuit / pattern design
Dive into our state-of-the-art solutions for debug and characterization of circuit design using advanced techniques such as optical transistor probing. This approach is crucial for locating timing faults and design marginalities that ultimately help to improve yield and reliability.
Photomask manufacturing
Gain insights into Hamamatsu's photonic solutions used in the highly challenging fields of photomask manufacturing and inspection. Various key technologies enable the industry's cutting-edge advancements in photomasks that support the process of photolithography in fabricating nanoscale structures.
Cleaning
Delve into Hamamatsu's enabling technologies that support the stringent cleanliness standards of the most demanding semiconductor manufacturing environments.
Photoresist coating
Learn about how Hamamatsu's products are used in the development and measurement of advanced photoresist coatings. From EUV photoresist research to film thickness measurements, solve a wide array of challenges with high performance photonic solutions ranging from the component to the integrated system level.
Photolithography
Discover the nuances of photolithography, including wafer edge exposure and the monitoring of emission wavelengths. Hamamatsu's advanced technologies, like UV-sensitive image sensors, play a vital role in ensuring the precise control of light sources, pivotal for the fabrication of cutting-edge semiconductor technology.
Etching
In situ monitoring of the etching environment is critical for process control and on-the-fly adjustments. Several key technologies, from Hamamatsu, from excitation sources to spectrometer end point monitors, address the etching challenges of the future.
Oxidation diffusion film deposition
The processes of oxidation diffusion and film deposition have required increasingly stringent controls for the manufacture of state-of-the-art integrated circuits. Learn about photonic solutions from Hamamatsu used to achieve these performance requirements.
Sputtering
Examine the importance of sputtering in semiconductor manufacturing, a controlled process that enables precise material coating on substrates. This method is crucial for the production of integrated circuits and advanced electronic components, highlighting the role of sputtering in achieving essential thin-film layers.
Ion implantation
Ion implantation is a process by which high-energy ions strategically alter the electrical properties of silicon, shaping the future of advanced transistors and integrated circuits. This technique is key to tailoring semiconductor materials for optimal device performance.
Wafer planarization
Chemical-mechanical planarization (CMP) is a process used in semiconductor manufacturing to remove surface materials and achieve the removal of flat surfaces. Precise process control during CMP is crucial for ensuring the production of defect-free, high-performance semiconductor devices.
Wafer inspection
Explore the intricacies of wafer inspection in semiconductor manufacturing. From advanced electron beam detection to broadband bright field to laser-based dark field, delve into the crucial processes ensuring defect-free and high-performance semiconductor devices. Discover the technologies that inspect for and ensure the quality and reliability of semiconductor wafers at every stage of production.
Semiconductor manufacturing process (back-end process)
Wafer grinding back-end
Learn more about the back-end processes of wafer grinding, which further thins semiconductor wafers, including how ESD, thickness measurement and wafer alignment are used.
Wafer dicing
Learn how the essential process of wafer dicing is made cleaner and more precise with advanced techniques like stealth dicing, a technique discovered and first commercialized by Hamamatsu. Explore the advantages that stealth dicing has over traditional techniques such as laser ablation and diamond scribing.
Die bonding
Unlock the world of die bonding in semiconductor manufacturing. Delve into critical products that monitor chip placement and alignment, with advanced technologies such as industrial cameras. Learn about the importance of high-speed alignment and how near infrared sensors inspect for cracks during die bonding.
Molding
Discover the essential molding process in semiconductor manufacturing and the devices used. Learn how xenon flash lamps play a crucial role in defect inspection during sealing, ensuring rapid and precise identification of irregularities.
Product inspection
Within semiconductor product inspection, explore advanced techniques for defect detection and fault location. Learn about nondestructive, noncontact methods leveraging faint light and heat signatures, with results integrated into the design for enhanced defect control and improved yield.
Marking
Enter the world of laser marking technology, where a focused laser beam meets the surface of materials to leave distinctive marks. Learn how this process, coupled with LCOS-SLM (Liquid Crystal on Silicon - Spatial Light Modulator), enables efficient batch marking of intricate two-dimensional codes on packages.
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