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MPPC

S13360-3050VE

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MPPC for precision measurement (COB package type),
Photosensitive area: 3 x 3 mm, Pixel pitch: 50 μm

The MPPC employes through-hole electrodes called TSV (through-silicon via). Since no electrode space for wire bonding is needed, the gap (between the package edge and the MPPC photosensitive area) around the outer periphery is reduced to 0.2 mm on the four sides, allowing a four-side buttable arrangement.
The product is optimized for medical imaging and high-energy particle detection requiring photon counting measurement, as well as other applications involving low-light-level detection.

Features
- Reduced crosstalk (compared to previous products)
- COB (chip on board) package with minimal dead space
- Tiling forms a large sensitive area
- Low afterpulse
* Please contact us for more details.

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Specifications

Effective photosensitive area 3 × 3 mm
Pixel pitch 50 μm
Number of pixels 3584
Number of channels 1 ch
Package Surface mount type
Cooling Non-cooled
Spectral response range 320 to 900 nm
Peak sensitivity wavelength (typ.) 450 nm
Dark count (typ.) 500 kcps
Terminal capacitance (typ.) 320 pF
Gain (typ.) 1.7×106
Measurement condition Ta=25 ℃, Vover=3 V

Dimensional outline (unit: mm)

k_s13360-3050ve_do_xx.jpg

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