MPPC

S13360-3050VE

MPPC for precision measurement (COB package type),
Photosensitive area: 3 x 3 mm, Pixel pitch: 50 μm


The S13360-2050VE/-3050VE/-6050VE are MPPCs for precision measurement miniaturized by the use of TSV (through-silicon via) and CSP (chip size package) technologies.
The adoption of a TSV structure made it possible to eliminate wiring on the photosensitive area side, resulting in a compact structure with little dead space compared with previous products. The fourside buttable structure allows multiple devices to be arranged side by side to fabricate large-area devices.
They are suitable for applications, such as medical, non-destructive inspection, environmental analysis, and high energy physics experiment, that require photon counting measurement.


Features
- Low crosstalk
- Low afterpulse
- Outstanding photon counting capability
- Compact chip size package with little dead space
- Low voltage (VBR=53 V typ.) operation
- High gain: 105 to 106

Package type Glass epoxy
Number of channels 1 ch
Effective photosensitive area / ch 3 × 3 mm
Number of pixels /ch 3584
Pixel size 50 μm
Spectral response range 320 to 900 nm
Peak sensitivity wavelength (typ.) 450 nm
Dark count/ch (typ.) 2000 kcps
Terminal capacitance/ch (typ.) 1300 pF
Gain (typ.) 1.7×106
Measurement condition Ta=25 ℃

Dimensional outline (unit: mm)

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