Hamamatsu Photonics Develops “HyperGauge® In-plane Film Thickness Meter” Achieves Full-Surface Measurement of 300 mm Wafers in Just 5 Seconds, Boosting Productivity Improvements in Semiconductor Manufacturing. Orders Accepted from December 1.

2025/12/01
  • Hamamatsu Photonics K. K.
    Headquarters: 325-6, Sunayama-cho, Chuo-ku,
    Hamamatsu City, Japan
    President and CEO: Tadashi Maruno

HyperGauge In-plane Film Thickness Meter C17319-11

HyperGauge In-plane Film Thickness Meter C17319-11

Hamamatsu Photonics has developed the “HyperGauge Thickness measurement system C17319-11,” a new device designed to enhance productivity in semiconductor manufacturing processes. This product features our proprietary wavelength detection technology, “λ-Capture®*1,”  which uses a high-sensitivity camera to enable full-surface measurement of wafers up to 300 mm in diameter in just 5 seconds. The device offers both high resolution and excellent measurement reproducibility, making it suitable for both bare and patterned wafer inspection. Its introduction is expected to reduce process losses and improve yield in semiconductor manufacturing.

Orders for this product will be accepted from December 1 (Monday), targeting domestic and international semiconductor manufacturers, semiconductor equipment manufacturers, and semiconductor inspection equipment manufacturers.

 

*1: λ-Capture: A proprietary wavelength detection technology that enables two-dimensional wavelength measurement without a spectrometer, allowing for high-speed spectral measurement across the entire wafer surface.