Si photodiode array


Back-illuminated photodiode array for non-destructive X-ray inspection, suitable structure for tiling

The S13620-02 is an 8 × 8 element Si photodiode array with a back-illuminated type structure for X-ray non-destructive inspection. The back-illuminated photodiode array is easy to handle because there are no bonding wires or photosensitive area on the incident surface side. You can mount a scintillator without being concerned about damaging wires. In addition, it is designed with minimal dead space around the product. This makes it possible to arrange multiple products side by side. There is no crosstalk between channels.

-2D (8 × 8 element) array
-Spectral response range: 400 to 1100 nm
-Package size: 24 (W) × 24 (H) mm
-Element pitch: 3.0 mm × 64 elements
-Easy coupling with a scintillator
  Because there are no wires in the photosensitive area and the optical coupling effi ciency with an scintillator can be maximized, it suitable for non-destructive X-ray inspection equipment.


The chip of this product is not sealed and is exposed.
Parts such as electrodes on the chip are not protected by an enclosure or window and so require especially strict care during handling compared to ordinary products.
Before using this product, always read “Precautions / Unsealed products” described below.


Element size (per 1 element) 2.5 × 2.5 mm
Number of elements 64
Package Glass epoxy
Package category Unsealed
Scintillator type None
Cooling Non-cooled
Reverse voltage (max.) 10 V
Spectral response range 400 to 1100 nm
Peak sensitivity wavelength (typ.) 960 nm
Photosensitivity (typ.) 0.61 A/W
Dark current (max.) 300 pA
Rise time (typ.) 15 μs
Terminal capacitance (typ.) 60 pF
Note These products are also available as scintillator-mounted products (custom order products) such as CsI (Tl), phosphor sheet, GOS, and CWO. Consult with your nearest Hamamatsu sales office.
Measurement condition Ta=25 ℃, per element, Photosensitivity: λ=920 nm

Dimensional outline (unit: mm)

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