A newly developed thermodynamic imaging module for PHEMOS®-X series emission microscopes

2025/05/08
  • Hamamatsu Photonics K. K.
    Headquarters: 325-6, Sunayama-cho, Chuo-ku,
    Hamamatsu City, Japan
    President and CEO: Tadashi Maruno

TD imaging module

TD imaging module

Hamamatsu Photonics’ PHEMOS-X series is a high-resolution range of emission microscopes that pinpoints failure locations in semiconductor devices by detecting weak light and heat emissions caused by device defects.

By leveraging our advanced technologies involving lasers, optical sensors, measurement, and image processing and analysis, we have now developed a TD imaging (ThermoDynamic imaging) technology to serve as a new detector module for the PHEMOS-X series. Mounting the TD imaging module into the PHEMOS-X series gives it the high sensitivity and high resolution needed to pinpoint failure locations in the latest cutting-edge semiconductor devices, such as generative AI chips, which have smaller and 3Dstructures. This new TD imaging module will significantly boost failure analysis success rates when testing these semiconductor devices.

We will begin accepting orders for this new TD imaging module from semiconductor device manufacturers in Japan and overseas starting Monday, 12 May 2025.

Semiconductor failure analysis systems Dual PHEMOS-X (left), iPHEMOS™-MPX (middle), PHEMOS-X (right)

Semiconductor failure analysis systems
Dual PHEMOS®-X (left), iPHEMOS®-MPX (middle), PHEMOS®-X (right)