Failure analysis system Failure analysis system

TD Imaging | Failure analysis system

About TD Imaging

TD Imaging is a new technology suitable for identifying defects in semiconductors with complex structures, such as logic semiconductors. It is available to pinpoint defects in semiconductors that contain metal parts internally.

Features

Patented Laser Scan Technology

Improves signal-to-noise ratio (S/N) by 38 times. Hamamatsu owns the patent for laser-based ThermoReflectance, delivering superior precision and reliability in thermal imaging-and continues to lead innovation in this field.

Optimal Wavelength Selection

670 nm light source, compared to 1300 nm, enhances S/N by 4 times on metals like CU and Al.

Higher Sensitivity

Flexible scan speed, size, and integrations, with data acquisition in 90 seconds, providing higher S/N than LIT.

Image of TD Imaging features

Comparison of TD Imaging and LIT

Comparison of TD Imaging and LIT

Proposed combined workflow

After detecting a wide range of signals using LIT technology, the PFA hit rate is improved by narrowing down the signals to 2 μm using TD Imaging(ThermoDynamic Imaging) while leveraging image processing. This makes defect identification more accurate and enhances the efficiency of analysis.

Proposed combined workflow

Related products

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iPHEMOS-MPX is a high-resolution emission microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by defects.

PHEMOS-1000

PHEMOS-1000 Emission microscope C11222-16

PHEMOS-1000 is a high-resolution emission microscope that captures light emission and heat generation caused by semiconductor device failures and locates the failure location.

 

*Discontinued product

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