Visit us at ECNDT 2026 | Hamamatsu Photonics Visit us at ECNDT 2026 | Hamamatsu Photonics

Booth highlights

See selected Hamamatsu X-ray NDT technologies in action at booth 206–207. Our planned booth demonstrations and displays are designed to help visitors explore image quality, system stability, and technology options for industrial inspection. Meet our team at the booth to discuss your application requirements and the most relevant solutions for your system or workflow.

 

Responsive Padding

Soft X-ray source and line scan live demo

Discover a demo combining a soft-X source (15 kV – 1 mA) and an X-ray line scan camera (XLS). This set-up is intended to illustrate how Hamamatsu’s technologies support in-line industrial X-ray NDT applications even for light and low-density materials.

 

Timing:  Available throughout the day at our booth

Video demonstrations at our booth

We will also be showing a series of demonstrations throughout the day, covering:

  • CMOS-TDI technology
  • PCB and electronics inspection with TDI line scan cameras
  • LiB micro-CT with MFX and FPS

Products on display

Microfocus X-ray sources

Explore our microfocus X-ray source offering, including the transmission-type L12531-01 110 kV mock-up and related materials. This area will highlight Hamamatsu’s approach to X-ray generation for demanding high-resolution industrial inspection tasks.

Line scan detectors

Learn more about our line scan detection capabilities, including CMOS-TDI technology, photodiode arrays and related inspection possibilities such as dual-energy approaches.

Flat panels and X-ray cameras

Explore selected detector technologies for 2D and 3D imaging, including planned displays of flat panel sensors and state-of-the-art X-ray cameras.

Selected Fairchild Imaging solutions

We also plan to highlight selected Fairchild Imaging technologies as part of our wider high-resolution X-ray detection offering.

Meet our team

Visit us at booth 206–207 to see the demos and speak directly with our specialists about your inspection requirements, system design, or integration challenges.


For more information, please contact us.

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