semiconductor failure analysis semiconductor failure analysis

Semiconductor Failure Analysis

The number of electronic control units integrated in automobiles increase continuously and more and more number of semiconductor devices will be integrated in those electronic control units. These devices need to have high reliability.  In order to assure the high reliability, automotive chip makers need to find any defects in semiconductor devices or electronic parts by screening.

車載センサ

Defects, Faults, Errors and Failures

Defects, Faults, Error, and Failures in Semiconductors

Car makers require “Zero defect” automotive components. Semiconductors are originally made based on the assumption that defective products occur in mass production.For this reason, the reliability of semiconductors is maintained by screening. As zero defects are required of automobile components, the possibility of faults is reduced by increasing the level of screening. However, strict screening tests lead significant costs.

欠陥・不良・異常・故障

半導体故障解析の流れ-1

Workflow of Semiconductor Failure Analysis

Hamamatsu has a portfolio of PHEMOS-X emission microscopes and iPHEMOS-MPX inverted emission microscopes. These systems have capabilities of performing various types of electrical failure analysis, such as Photo emission analysis, thermal emission analysis and IR-OBIRCH analysis etc. Automotive chip makers are able to narrow down the suspicious defect portion for physical failure analysis. This workflow can assure the robustness.

半導体故障解析の流れ-2

Recommended Products

Wafer process

The iPHEMOS-MPX inverted emission microscope is a semiconductor failure analysis system designed to identify failure locations by detecting the light and heat emitted from the defects in semiconductor devices. Taking advantage of its inverted type design, the iPHEMOS-MPX enables backside analysis of semiconductor devices while multi-pin needle probing to 300 mm wafers.

Inverted emission microscope for analyzing semiconductor wafers from the backside. Direct docking dedicated prober enables multi-pin needle attachment to 300 mm wafers and with the additional option, it is possible to perform package analysis as well as pin-needle attachment by a manipulator.

Assembly and testing process

The PHEMOS-X is a high-resolution emission microscope that pinpoints failure locations in semiconductor devices by detecting the weak light emissions and heat emissions caused by semiconductor device defects. The PHEMOS-X supports a wide variety of tasks and applications covering from socket boards to a wafer prober.

High resolution emission microscope with IR laser confocal microscope. It can be customized upon request.

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