Bonding crack Inspection for cracks

Chip status check

During die bonding, chip status check verifies the condition of the microchip before attachment to a substrate. This inspection is essential for identifying defects, preventing contamination, and optimizing the overall quality of the bonding process. Real-time monitoring allows for adjustments, contributing to higher yield rates and cost efficiency. Subsequently, in the molding phase, the chip status check continues its crucial role by inspecting the chip's condition before encapsulation. This step is paramount for identifying any defects or contaminants that could compromise the reliability and functionality of the final molded semiconductor product. The meticulous examination of the chip status in both die bonding and molding ensures the production of robust and reliable semiconductor devices.

Recommended products

Laser-Driven Light Sources (LDLS)

These are the world's only light sources that use a method of maintaining emission by generating plasma with a focused laser beam between discharge electrodes in a bulb filled with xenon gas. Compared to conventional xenon lamps, these light sources provide higher bright light in the ultraviolet region and have features such as long life and minute emission points.

Photomultiplier tubes

Photomultiplier tubes are widely used in semiconductor wafer inspection systems. In wafer inspection, the wafer is scanned by a laser beam, and the scattered light caused by dirt or defects is detected by a photomultiplier tube.  

The following photomultiplier tubes are recommended for their high quantum efficiency, good uniformity and low spike noise.

CMOS area image sensor  S13101

This APS CMOS area image sensor has high sensitivity in the near infrared region. The pixel format is SXGA (1280 x 1024 pixels), capable of imaging at up to 146 frames/s.

CCD area image sensor  S10201-04-01

This TDI-CCD provides images with sufficient brightness even in low-light conditions, such as during high-speed imaging. TDI operation dramatically improves sensitivity by integral exposures of moving objects.

This camera has sensitivity in the near infrared region. The camera enables inspection of defects and voids by imaging the internal structures through transmission.

Deuterium lamps (D2 lamps)

This light source has high output and high stability in the ultraviolet region. The light source has a continuous spectrum in the ultraviolet region and also has the long life, high stability, and high output required for lamps used in analytical instruments.

Xenon & mercury-xenon lamps

This light source has a continuous spectrum from the ultraviolet to infrared regions with high brightness and color temperature. It is widely used as a precision photometric lamp due to the use of our unique high-performance cathode.

Xenon flash lamps

This pulsed light source has a high instantaneous peak power. With the continuous spectrum from ultraviolet to infrared regions of the light source, a wide range of applications are available from analysis to imaging.

Semiconductor processes using chip status check

Die bonding

The chip status check in die bonding is essential for ensuring the quality, reliability, and cost efficiency of semiconductor manufacturing by verifying the integrity of the chip, preventing contamination, optimizing yield, and contributing to the overall success of the production process. Early detection and resolution of issues during this step help minimize defects and enhance the long-term performance of the final semiconductor devices.

 

Molding

The chip status check in molding plays a critical role in ensuring the integrity of semiconductor devices by inspecting the condition of the chip before encapsulation. This step is vital for identifying any defects or contaminants that could compromise the reliability and functionality of the final semiconductor product.

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