Thickness measurement

Precision in semiconductor manufacturing: The significance of thickness measurement in wafer grinding and planarization processes
Ellipsometry for precise photoresist thickness control
Photonics in thin film processes: Precise measurement techniques for etching, oxidation, and sputtering
Recommended products
Optical MicroGauge Thickness measurement system C11011-02
Semiconductor processes using thickness measurement

Precision in semiconductor manufacturing: The significance of thickness measurement in wafer grinding and planarization processes

The significance of thickness measurement in wafer grinding and planarization processes

Thickness measurement plays a crucial role in wafer grinding and wafer planarization processes within the semiconductor industry. In wafer grinding, excess material is removed to achieve the desired thickness. Accurate thickness measurement ensures precision and uniformity across the wafer surface. This is essential for maintaining consistent electrical and mechanical properties of the integrated circuits. Wafer planarization, on the other hand, involves the smoothing of the wafer surface after various fabrication steps. Accurate thickness measurement during planarization ensures that the wafer achieves the desired level of flatness, minimizing surface irregularities and enhancing overall chip performance. Advanced metrology techniques, such as optical interferometry and other non-destructive methods, are employed to measure wafer thickness with high precision, contributing to the quality and reliability of semiconductor devices in the rapidly evolving technology landscape.

Ellipsometry for precise photoresist thickness control

Ellipsometry is used during the photoresist step to ensure precise control over layer thickness. A laser emits polarized light onto the wafer's photoresist, and ellipsometry analyzes changes in the reflected light's polarization state. This non-destructive technique provides real-time monitoring, in-situ film thickness control. enabling accurate measurements of photoresist thickness. The obtained data contributes to uniformity across the wafer, optimizing subsequent patterning steps and overall process performance.

Photonics in thin film processes: Precise measurement techniques for etching, oxidation, and sputtering

Precise measurement techniques for etching, oxidation, and sputtering

Light can be used to perform noncontact, in-situ film thickness measurements. These techniques can handle a large range of film thicknesses as well as ultra-thin films with high-luminescent, short-wavelength light.

Precision control through thickness measurement: Enhancing semiconductor wafer quality in fabrication, back-end processing, and dicing

Enhancing semiconductor wafer quality in fabrication, back-end processing, and dicing

In the final stage of wafer dicing, thickness measurement becomes crucial to verify that thinned wafers meet specified requirements before being diced into individual chips. Optical sensors, laser displacement sensors, and non-contact methods contribute to precision in ensuring the uniformity of the wafer thickness, thus influencing the reliability and functionality of the resulting semiconductor devices.

Recommended products

Optical NanoGauge thickness measurement system C13027-12

Contactless, real-time thickness measurement for thin films is possible. This device achieves miniaturization for easy installation into equipment.

Optical MicroGauge Thickness measurement system C11011-02

Contactless, real-time thickness measurement for thin films is possible. The device achieves miniaturization for easy installation into equipment.

Laser-Driven Light Sources (LDLS)

This is the world's only light source that uses a method of maintaining emission by generating plasma with a focused laser beam between discharge electrodes in a bulb filled with xenon gas. The light source has point emission with higher brightness and longer life than conventional xenon lamps.

Mini-spectrometers

These compact spectrometers integrate an optical system, image sensor, and circuitry, covering a wide range of wavelengths from the ultraviolet to near-infrared regions.

InGaAs linear image sensors

Hamamatsu provides high sensitivity low noise InGaAs image sensors with multiple cutoff wavelegnth from 1.7um to 2.5um.

Line sensors for spectrophotometry

A wide range of products are available according to wavelength and purpose of use, including types with high sensitivity in the ultraviolet and near-infrared regions and types with high resistance to ultraviolet irradiation.

Semiconductor processes using thickness measurement

Wafer grinding

Wafer grinding relies on thickness measurement to achieve precise wafer thinning. Accurate monitoring ensures uniform material removal, preventing over-grinding and maintaining desired thickness for subsequent semiconductor processing, enhancing overall device performance.

Wafer planarization

In wafer planarization, thickness measurement ensures uniform removal of material, enhancing semiconductor wafer flatness. Precise monitoring guides the planarization process, optimizing the wafer's topography for subsequent layer deposition and improving overall device performance.

Photoresist coating

Thickness measurement in photoresist coating ensures uniformity for optimal pattern transfer during photolithography. Accurate measurement is vital for controlling optical properties, guiding subsequent etching processes, and overall process optimization to enhance yield and reduce defects in the fabrication of semiconductor devices.

Etching

In etching, thickness measurement can be used to monitor and control the etching process.

Oxidation diffusion film deposition

Thickness measurements are used in the oxidation and diffusion film deposition steps to ensure precise control of film thickness, optimizing the performance and reliability of electronic devices by monitoring and adjusting the deposition process.

Sputtering

Thickness measurement in the sputtering process is essential for achieving uniform coatings and adhering to design specifications. Techniques like spectroscopic ellipsometry and interferometry allow real-time monitoring of film thickness, enabling precise control over deposition parameters and ensuring the functionality of thin films in applications such as semiconductor device fabrication.

Ion implantation

Thickness measurement is essential in ion implantation to ensure precise control over doping profiles and maintain material integrity. It determines the target layer's thickness for accurate ion penetration, provides feedback on implantation parameters, and verifies uniformity across the wafer. Post-implantation checks confirm no excessive thinning occurred, ensuring the device's performance and reliability. Techniques like ellipsometry, X-ray reflectometry, and interferometry provide precise, non-destructive thickness measurements critical for quality control in semiconductor manufacturing.

Wafer inspection

Thickness measurement is integral to semiconductor wafer inspection, ensuring uniformity for high-quality integrated circuits and optimal performance in electronic devices.

Wafer grinding back-end

In the wafer grinding back-end process, thinning the wafer is essential to enhance device performance and minimize heat dissipation. Precision in this thinning process is achieved through methods like mechanical grinding or chemical mechanical polishing (CMP), where accurate thickness measurement tools such as stylus profilers or optical sensors play a crucial role. These tools ensure uniformity, enabling control over the thinning process to attain the desired wafer thickness consistently across the entire semiconductor substrate.

Wafer dicing

In the wafer dicing stage, following the thinning process, the wafer is segmented into individual chips, each destined to become an independent semiconductor device. Maintaining consistent thickness is paramount to achieving uniformity in the resulting integrated circuits (ICs). To ensure compliance with specifications, thickness measurement is commonly conducted post-thinning and pre-dicing, employing precise tools such as optical sensors, laser displacement sensors, or other non-contact methods for accurate measurement of the wafer thickness.