Sputtering

This process forms a thin film by depositing a material atomized by inert gas to the surface of a wafer.

Sputtering is a foundational process in semiconductor manufacturing, serving as a key method for thin-film deposition. In this technique, a target material undergoes bombardment by high-energy ions in a vacuum, causing atoms or molecules to dislodge and form a vapor. This vapor condenses onto a nearby substrate, often a semiconductor wafer, creating a thin and uniform coating. The process offers precise control over film thickness and allows for the deposition of various materials crucial for the fabrication of integrated circuits and other electronic and optical components. Sputtering's versatility, with advantages like excellent step coverage and the capability to deposit materials with specific properties, makes it an integral step in achieving the thin-film layers essential for the functionality and performance of advanced semiconductor devices.

Common process steps across semiconductor manufacturing

Thickness measurement

Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.

Endpoint detection, plasma luminescence analysis

Learn more about our cutting-edge solutions in endpoint detection and plasma luminescence analysis for semiconductor manufacturing. Discover advanced technologies that offer real-time monitoring, ensuring precision and control in processes such as etching, oxidation diffusion film deposition, and sputtering.

Electrostatic charge removal (ESD)

Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

Inspection for particle contamination and surface defects

Ensure pristine semiconductor production with Hamamatsu's advanced wafer inspection for contaminates solutions. Discover our sophisticated technologies meticulously crafted for accurate contaminant detection, safeguarding semiconductor wafers from impurities. Explore how Hamamatsu's expertise in wafer inspection sets the standard for reliability and quality in semiconductor manufacturing processes.

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