Wafer grinding back-end

This process thins a wafer by grinding it with a grinding wheel.

The wafer grinding back-end process, following front-end semiconductor manufacturing, thins wafers using specialized grinding machines and CMP. In-line metrology ensures thickness tolerances. After thinning, wafers are cleaned to remove residues, mounted on temporary carriers for processes like backside metallization and dielectric deposition, and then diced into individual chips. Continuous quality control, including defect inspections and in-line metrology, ensures semiconductor device reliability.

Recommended product

InGaAs camera C14041-10U

Hamamatsu's InGaAs camera enhances in-line metrology with its high sensitivity and user-friendly design. Offering options from line scan to high-resolution area imaging, it fulfills diverse needs, from budget-conscious to high-performance requirements.

Common process steps across semiconductor manufacturing

Electrostatic charge removal (ESD)

Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.

Thickness measurement

Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

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