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Product inspection
This process conducts final inspections such as electrical characteristic inspection and appearance inspection.
In semiconductor manufacturing, product inspection ensures device quality and reliability. It starts with raw material examination, progresses through automated optical inspection (AOI) for defect detection in various stages like photolithography and CMP, and employs metrology tools for film assessment. Final stages involve thorough electrical and packaging inspections, emphasizing fault location identification. Statistical methods ensure continuous quality control. This intricate process maintains device integrity, functionality, and compliance with specifications.
Defect inspection
Defect inspection in semiconductor manufacturing aims to identify internal flaws without compromising device integrity. It employs nondestructive and noncontact techniques to detect microdefects like cracks and voids. Advanced microscopy and imaging systems enable precise analysis, ensuring thorough examination without risking damage to semiconductor components. This meticulous process enhances quality assurance and device reliability.
These are microfocus X-ray sources for X-ray nondestructive inspection. The Micro-focus enables the acquisition of high-definition X-ray images even at high geometric magnification.
These 1D X-ray cameras are used for nondestructive X-ray inspection. These cameras image the inside of an object being transported with X-rays. High-speed imaging is possible, and it can also be used for total inspection.
This camera uses “time delay integration (TDI)” — a special readout method for CCDs. The combination of high speed and high sensitivity enables clear imaging by integrating images according to the movement of the inspected object being transported.
Hamamatsu's InGaAs camera enhances SWIR inspection with its high sensitivity and user-friendly design. Offering options from line scan to high-resolution area imaging, it fulfills diverse needs, from budget-conscious to high-performance requirements.
Identification of fault location
Fault location identification ensures semiconductor device quality and reliability by pinpointing specific defect areas. Advanced technologies detect subtle indicators like light and heat variations. This process involves sophisticated methods analyzing faint signals emitted by defective components, feeding back into design and manufacturing for continuous improvement. This dynamic feedback loop optimizes defect control measures and enhances manufacturing processes, ultimately improving yield and product quality.
Recommended product
Contactless, real-time thickness measurement for thin films is possible. The device achieves miniaturization for easy installation into equipment.
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