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Wafer grinding
The semiconductor wafer grinding process is a critical step in the fabrication of integrated circuits (ICs) and other semiconductor devices. It involves removing excess material from the surface of a semiconductor wafer to achieve the desired thickness, planarity, and surface quality.
Wafer grinding is a crucial process in semiconductor manufacturing, specifically designed to thin down semiconductor wafers to achieve the desired thickness, planarity, and surface quality. An abrasive grinding wheel is employed to carefully remove material from the backside of the wafer, ensuring uniform and controlled material removal. Precision is paramount, and some advanced systems utilize in process measurements to monitor and regulate wafer thickness in real-time. Following grinding, a final polishing step may be applied to enhance the wafer's surface finish and eliminate any residual defects introduced during the grinding process. Wafer grinding is particularly critical and the precision achieved in wafer grinding plays a fundamental role in determining the overall quality, performance, and reliability of the final semiconductor products.
Bare wafer inspection
Wafers are inspected for particles, pits, bumps, scratches, stains, contaminants, and other defects that may cause failure. Scanning electron microscopy (SEM) is used to review defects. Light receiving and emitting devices, which are compatible with various wavelength ranges such as ultraviolet, infrared, X-ray, and electron beams, enable nondestructive, noncontact inspection for submicron particles and microdefects. Overall, bare wafer inspection plays a crucial role in maintaining quality, optimizing processes, and reducing costs by preventing the production of defective semiconductor devices and minimizing material waste.
Recommended products
These are microfocus X-ray sources for X-ray nondestructive inspection. The microfocus enables the acquisition of high-definition X-ray images even at high geometric magnification.
These 2D X-ray cameras are used for nondestructive X-ray inspection. These cameras have a magnification function, enabling the acquisition of high-resolution, high-contrast X-ray images at high speeds.
Photomultiplier tubes are widely used in semiconductor wafer inspection systems. In wafer inspection, the wafer is scanned by a laser beam, and the scattered light caused by dirt or defects is detected by a photomultiplier tube.
The following photomultiplier tubes are recommended for their high quantum efficiency, good uniformity and low spike noise.
A wide range of products are available according to wavelength and purpose of use, including types with high sensitivity in the ultraviolet and/or near-infrared regions and types with high resistance to ultraviolet irradiation.
These are the world's only light sources that use a method of maintaining emission by generating plasma with a focused laser beam between discharge electrodes in a bulb filled with xenon gas. Compared to conventional xenon lamps, these light sources provide higher bright light in the ultraviolet region and have features such as long life and minute emission points.
Hamamatsu's InGaAs camera enhances SWIR inspection with its high sensitivity and user-friendly design. Offering options from line scan to high-resolution area imaging, it fulfills diverse needs, from budget-conscious to high-performance requirements.
Spectroscopic reflectometry
Spectroscopic reflectometry plays a crucial role in ensuring that semiconductor wafers are ground to the required thickness and quality, which is essential for the production of integrated circuits and other semiconductor devices. It provides real-time measurement and control capabilities that help semiconductor manufacturers achieve precise and consistent results.
Recommended product
The OPAL-Luxe can be used for spectroscopic reflectometry during wafer grinding or CMP steps of the semiconductor manufacturing process.
Common process steps across semiconductor manufacturing
Thickness measurement
Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.
Electrostatic charge removal (ESD)
Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.
Wafer alignment
Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.
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