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Die bonding
This process mounts a chip on a substrate.
Die bonding is a crucial step in semiconductor manufacturing. After preparing semiconductor wafers and creating individual dies, the die attach process involves placing a semiconductor die onto a substrate or package. Two primary bonding techniques are used: eutectic bonding and adhesive bonding. Some applications include optional encapsulation or sealing steps, where the die and wire bonds are covered with protective materials like epoxy resin to safeguard the semiconductor device from environmental factors.
Chip placement/alignment
This involves adjusting the position of pickups and mounts. As semiconductor devices become smaller, finer, and more highly integrated, even slight misalignments can lead to defects and decreased throughput. Therefore, utilizing high-speed and high-precision InGaAs cameras for alignment is essential.
Recommended product
Hamamatsu's InGaAs camera enhances SWIR inspection with its high sensitivity and user-friendly design. Offering options from line scan to high-resolution area imaging, it fulfills diverse needs, from budget-conscious to high-performance requirements.
Local soldering
Local soldering with a laser is a precise technique in semiconductor manufacturing, used during die bonding. It involves directing a condensed laser beam onto solder paste to create metallurgical bonds between the die and substrate. This method offers advantages for miniaturized components and intricate designs, ensuring high-quality solder joints with minimal heat impact on surrounding areas. In-situ temperature based inspections confirm solder joint integrity, ensuring semiconductor device reliability and manufacturing in real time.
Recommended products
This spot laser light source is highly reliable, and can be easily controlled by an external control signal. The laser light source has wavelengths in the infrared region required for heating.
The T-SMILS system integrates Hamamatsu's in-house diode laser with real time temperature sensing and feedback to ensure repeatable, defect free material processing. The system is ready for integration with various control interfaces, making it an ideal solution for laser heating and laser processing applications.
Inspection for cracks
During die bonding, InGaAs cameras are indispensable for inspecting chips to detect internal defects. SWIR technology allows these cameras to penetrate certain opaque semiconductor layers, revealing voids, cracks, and other flaws that could compromise chip performance.
Chip bonding/alignment
Accurate alignment of device stacking positions is crucial for reliable electrode alignment during stacking, especially with the increasing demand for 3D packaging. High-speed and high-precision positional information acquisition is essential to meet these demands, ensuring precise stacking of devices and mounting them on wafers without misalignment.
Recommended product
Hamamatsu's InGaAs camera enhances SWIR inspection with its high sensitivity and user-friendly design. Offering options from line scan to high-resolution area imaging, it fulfills diverse needs, from budget-conscious to high-performance requirements.
Common process steps across semiconductor manufacturing
Wafer alignment
Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.
Chip status check
Optimize semiconductor production efficiency with Hamamatsu's innovative chip status check solutions. Explore advanced technologies for accurate and real-time monitoring, ensuring optimal performance and reliability of semiconductor chips. Discover our solutions for chip status check that will help elevate the quality and efficiency of your semiconductor manufacturing processes.
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