Photoresist coating

This process uniformly coats a wafer surface with a photosensitive agent called photoresist.

Photoresist coating is a pivotal step in semiconductor manufacturing, specifically within the photolithography process. In this process, a semiconductor wafer undergoes spinner coating, where liquid photoresist is evenly spread across its surface through rapid spinning. Following this, a soft bake removes solvents and enhances adhesion. The success of semiconductor fabrication heavily relies on the precision and uniformity achieved during photoresist coating. The choice between positive and negative photoresists, as well as the careful execution of soft and hard bake steps, plays a crucial role in determining the effectiveness of subsequent processes.

Common process steps across semiconductor manufacturing

Thickness measurement

Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.

Electrostatic charge removal (ESD)

Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.

In-line wet process concentration monitoring

Elevate semiconductor manufacturing efficiency with Hamamatsu's in-line wet process concentration monitoring solutions. Explore our advanced technologies designed for real-time and accurate monitoring of chemical concentrations in wet processes. Discover how Hamamatsu is revolutionizing in-line monitoring, ensuring precise control and optimization of chemical processes for superior semiconductor production.

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

Inspection for particle contamination and surface defects

Ensure pristine semiconductor production with Hamamatsu's advanced wafer inspection for contaminates solutions. Discover our sophisticated technologies meticulously crafted for accurate contaminant detection, safeguarding semiconductor wafers from impurities. Explore how Hamamatsu's expertise in wafer inspection sets the standard for reliability and quality in semiconductor manufacturing processes.

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