Molding

This process encapsulates a chip with resin.

In semiconductor packaging, transfer molding is essential for encapsulating packages, protecting fragile IC assemblies with their delicate interconnection wires, and ensuring high electrical insulation between conductors, interconnections, and other electrical components. Molding technologies are integral to semiconductor manufacturing, sealing semiconductors with resin to guarantee their reliability and longevity.

Defect inspection

Defect inspection

Defect inspection during sealing is critical for detecting foreign particles, especially with narrower pitches. Xenon flash lamps provide intense illumination for detailed inspection of encapsulated surfaces, ideal for high-speed manufacturing.

Recommended product

This lineup of various light sources are capable of emitting the high-luminance light required for foreign matter inspection.

Common process steps across semiconductor manufacturing

Chip status check

Optimize semiconductor production efficiency with Hamamatsu's innovative chip status check solutions. Explore advanced technologies for accurate and real-time monitoring, ensuring optimal performance and reliability of semiconductor chips. Discover our solutions for chip status check that will help elevate the quality and efficiency of your semiconductor manufacturing processes.

Contact us for more information.

Contact us