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Wafer dicing
This process cuts a wafer into separate chips.
In semiconductor manufacturing, wafer dicing separates a single semiconductor wafer into individual pieces, known as dies or chips. This process is crucial for transforming a large, uniformly processed wafer into discrete units capable of functioning as independent electronic devices. Dicing usually occurs after completing front-end processes like lithography and etching, where semiconductor devices are formed on the wafer surface.
Stealth dicing
Stealth dicing technology revolutionizes laser dicing with its innovative approach, offering a "completely dry process," "no kerf loss," "no chipping," and "high bending strength." It achieves this by focusing a laser beam of a wavelength that penetrates materials, forming a starting point for cracking the wafer internally (the "SD layer"), and then applying external stress to separate it. The process consists of two primary parts: the "laser irradiation process," forming the SD layer to crack the wafer interior, and the "expansion process," which separates the wafer.
Recommended product
This dicing technology uses a laser to perform internal processing and cut wafers at high speed and with high quality. Blade dicing problems are solved by, for example, achieving a noncontact, fully dry process.
These reflective spatial light phase modulators freely modulate the phase of light. Applications include optical beam pattern shaping and aberration correction.
Dicing tape peeling
Dicing tape peeling follows wafer dicing, removing the tape holding individual dies together. Specialized machines carefully peel the tape to avoid damaging delicate semiconductor structures. Cleanliness is crucial post-peeling, with additional processes to remove adhesive residue. Highly uniform UV irradiation enables high-quality removal of the dicing tape.
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This UV-LED light source is a high power linear irradiation type with a unique air-cooling system. Our unique optical system enables dicing tape removal with high quality by highly uniform UV irradiation.
This spot laser light source is highly reliable, and can be easily controlled by an external control signal. The laser light source has wavelengths in the infrared region required for heating.
Common process steps across semiconductor manufacturing
Electrostatic charge removal (ESD)
Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.
Thickness measurement
Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.
Wafer alignment
Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.
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