Oxidation diffusion film deposition

This process forms a thin film such as an insulating film on a substrate.

Here we introduce our products used in the processes of oxidation, diffusion and film formation.

Oxidation diffusion film deposition is a key process in semiconductor manufacturing, involving the growth of a thin oxide layer on a semiconductor wafer through controlled oxidation. The process aims to modify the electrical properties of the semiconductor material, typically introducing dopants during or after oxidation to achieve specific conductivity characteristics. This method is crucial for creating the necessary insulating and conductive layers in semiconductor devices, contributing to the formation of intricate circuitry and ensuring the functionality and performance of the final electronic components. The subsequent step often involves annealing, a thermal treatment, to activate dopants and enhance the overall structural and electrical properties of the semiconductor materials.

Annealing

Annealing

In semiconductor manufacturing, annealing is a vital step in oxidation and diffusion film deposition. This thermal treatment involves heating the wafer to enhance properties like crystal defects. Techniques like rapid thermal annealing (RTA) and laser annealing, utilizing infrared rays and ultraviolet lasers, respectively, contribute to rapid heating and recrystallization. These methods play a crucial role in improving wafer yield, ensuring the integrity of semiconductor materials, and refining electrical characteristics in the fabrication of intricate semiconductor devices.

Recommended products

DFB-CW QCL

These are semiconductor lasers with wavelengths in the mid-infrared (4 to 10 µm). These lasers oscillate in the wavelength region where the absorption of substances due to molecular vibration is large, enabling selective heating using the substance-specific absorption wavelength.

InAsSb photovoltaic detectors

These detectors achieve high sensitivity in the 5 μm, 8 μm, and 10 μm wavelength bands using our unique crystal technology. The detectors feature a fast response and are used for infrared measurement in combination with a quantum cascade laser (QCL).

Common process steps across semiconductor manufacturing

Endpoint detection, plasma luminescence analysis

Learn more about our cutting-edge solutions in endpoint detection and plasma luminescence analysis for semiconductor manufacturing. Discover advanced technologies that offer real-time monitoring, ensuring precision and control in processes such as etching, oxidation diffusion film deposition, and sputtering.

In-line wet process concentration monitoring

Elevate semiconductor manufacturing efficiency with Hamamatsu's in-line wet process concentration monitoring solutions. Explore our advanced technologies designed for real-time and accurate monitoring of chemical concentrations in wet processes. Discover how Hamamatsu is revolutionizing in-line monitoring, ensuring precise control and optimization of chemical processes for superior semiconductor production.

Thickness measurement

Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.

Electrostatic charge removal (ESD)

Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

Inspection for particle contamination and surface defects

Ensure pristine semiconductor production with Hamamatsu's advanced wafer inspection for contaminates solutions. Discover our sophisticated technologies meticulously crafted for accurate contaminant detection, safeguarding semiconductor wafers from impurities. Explore how Hamamatsu's expertise in wafer inspection sets the standard for reliability and quality in semiconductor manufacturing processes.

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