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Photomask manufacturing
This process creates an original plate for transferring a designed pattern onto a wafer. Here we introduce our products used in the process of photomask creation.
Photomask manufacturing is a critical aspect of semiconductor production, involving the creation of precise patterns that are subsequently transferred onto semiconductor wafers during the photolithography process. A photomask, essentially a high-precision stencil, carries the detailed circuit design that acts as a template for the creation of microscopic features on the wafer. The manufacturing process begins with the design data obtained from the circuit or pattern design phase. The quality and precision of the photomask are paramount, as any defects or inaccuracies in the photomask directly impact the final semiconductor device's performance. After fabrication, the photomask undergoes thorough inspection and verification processes to ensure it meets stringent standards.
Photomask (reticle) inspection
The primary purpose of photomask inspection is to verify the integrity of the photomask, including the blank mask quality, accuracy of the circuit patterns, absence of defects, and overall quality. The inspection methods describe below are commonly used for the current production environment, optical inspection, E-beam inspection, review stations, defect classification, repair and verification, and mask metrology. The inspection process consists of two primary subprocesses: blank mask inspection and pattern mask inspection.
Blank mask inspection
Blank mask inspection ensures that these substrates are free from defects or flaws that could lead to errors in the final semiconductor device. The primary purpose of blank mask inspection is to identify and eliminate any defects or contaminants on the mask that could be transferred onto the wafer during the photolithography process. Defects on the mask can result in defective or nonfunctional semiconductor devices. Blank mask defects can include particles, pinholes, scratches, and contamination.
Pattern mask inspection
Once the circuit patterns are added to the mask through a series of photolithography steps, the patterned mask undergoes a separate inspection process. This stage involves evaluating the accuracy and precision of the etched or deposited patterns on the mask. Pattern mask inspection ensures that the intended circuit design is faithfully represented on the mask, with a focus on identifying defects such as pattern deviations, missing features, or any anomalies that could affect the quality of the semiconductor manufacturing process.
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EQ-10 produces 13.5nm EUV light for EUV actinic mask inspection. Patented Electrodeless Z-pinch technology provides stable, low debris, compact and cost effective EUV light.
Image sensors play a critical role in photomask quality control. They are used for photomask inspection, defect detection, alignment, and overlay measurement, ensuring precise and defect-free patterning on semiconductor wafers.
Defect inspection
This inspects defects such as foreign matters and pattern defects on photomasks. X-ray sources and X-ray cameras enable nondestructive, noncontact inspection of minute foreign matters and microdefects.
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These are microfocus X-ray sources for X-ray nondestructive inspection. The microfocus enables the acquisition of high-definition X-ray images with less blurring even at high geometric magnification.
These 2D X-ray cameras are used for nondestructive X-ray inspection. These cameras have a magnification function, enabling the acquisition of high-resolution, high-contrast X-ray images at high speeds.
This highly sensitive detector is used for various defect inspections, endpoint monitors, and other applications. The combination with high-speed phosphors and scintillators enables detection of faint electron beams that photodiodes cannot detect, allowing the use in scanning electron microscopy (SEM) and other applications.
These cameras use “time delay integration (TDI)” — a special readout method for CCDs. The combination of high speed and high sensitivity enables clear imaging by integrating images according to the movement of the inspected object being transported.
Common process steps across semiconductor manufacturing
Electrostatic charge removal (ESD)
Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.
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