Wafer planarization

This process flattens the surface of a wafer by removing unevenness of the surface.

Wafer planarization is a vital step in semiconductor manufacturing, focusing on achieving a flat and smooth surface on the semiconductor wafer. Often accomplished through chemical-mechanical planarization (CMP), this process utilizes a rotating platen and a polishing pad with a slurry containing abrasive particles. CMP selectively removes irregularities on the wafer surface, ensuring uniformity crucial for subsequent lithography and etching processes in integrated circuit fabrication. This technique reduces stress, enhances electrical performance, and facilitates the integration of multiple layers, contributing to the overall quality and reliability of advanced semiconductor devices.

Common process steps across semiconductor manufacturing

Thickness measurement

Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.

Electrostatic charge removal (ESD)

Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

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