Marking

This process marks a product name and a lot number on a wafer for identification and traceability.

 

Semiconductor manufacturing involves marking wafers and individual devices for traceability. Wafers receive unique codes, and devices are marked with part numbers, date codes, or batch information. Methods include ink and laser marking, with laser providing precise and durable markings. Data Matrix codes enhance information storage.

Laser marking

Laser marking

Laser marking utilizes a laser beam to modify material surfaces, creating visible marks commonly used for labeling packages with essential information. Pairing with technologies like LCOS-SLM enable batch marking of minute two-dimensional codes, markedly enhancing efficiency and accuracy in identification processes.

Recommended products

LCOS-SLM (optical phase modulator) X15213 series

These reflective spatial light phase modulators freely modulate the phase of light. Applications include optical beam pattern shaping and aberration correction.

Common process steps across semiconductor manufacturing

Wafer alignment

Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.

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