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Etching
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing.
Etching is a vital semiconductor manufacturing process used to selectively remove material from a semiconductor wafer, creating precise patterns and structures. The process is employed after photolithography, where a patterned mask is created on the wafer's surface using light-sensitive photoresist. Etching can be either wet or dry. In wet etching, the wafer is immersed in a liquid chemical solution that selectively removes the exposed or unprotected areas of the wafer, leaving behind the desired pattern. Dry etching involves the use of reactive gases in a vacuum chamber, where these gases chemically react with the exposed areas of the wafer and remove material, allowing for highly controlled and precise etching.
The choice between wet and dry etching depends on factors such as the materials involved, the desired pattern complexity, and the overall manufacturing requirements. Etching is a key step in defining the intricate features of semiconductor devices, such as transistors and interconnects. It contributes significantly to the overall precision and functionality of the final semiconductor product by shaping the semiconductor material according to the specifications laid out in earlier design and patterning stages.
Common process steps across semiconductor manufacturing
Endpoint detection, plasma luminescence analysis
Learn more about our cutting-edge solutions in endpoint detection and plasma luminescence analysis for semiconductor manufacturing. Discover advanced technologies that offer real-time monitoring, ensuring precision and control in processes such as etching, oxidation diffusion film deposition, and sputtering.
Electrostatic charge removal (ESD)
Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.
Optical critical dimension (OCD) measurement
Unlock unparalleled precision in semiconductor manufacturing with Hamamatsu's optical critical dimension (OCD) measurement solutions. Explore our advanced technologies tailored for accurate and reliable measurement of critical dimensions in nanoscale structures. Discover how Hamamatsu is reshaping the landscape of OCD measurement, delivering cutting-edge solutions for superior quality and performance in semiconductor fabrication processes.
Thickness measurement
Optimize precision in material analysis with Hamamatsu's solutions for thickness measurement. Explore our technologies designed for accurate and reliable thickness measurement across various materials and see how we are helping the industry with advanced measurement capabilities, ensuring superior quality and performance for your applications.
In-line wet process concentration monitoring
Elevate semiconductor manufacturing efficiency with Hamamatsu's in-line wet process concentration monitoring solutions. Explore our advanced technologies designed for real-time and accurate monitoring of chemical concentrations in wet processes. Discover how Hamamatsu is revolutionizing in-line monitoring, ensuring precise control and optimization of chemical processes for superior semiconductor production.
Wafer alignment
Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.
Inspection for particle contamination and surface defects
Ensure pristine semiconductor production with Hamamatsu's advanced wafer inspection for contaminates solutions. Discover our sophisticated technologies meticulously crafted for accurate contaminant detection, safeguarding semiconductor wafers from impurities. Explore how Hamamatsu's expertise in wafer inspection sets the standard for reliability and quality in semiconductor manufacturing processes.
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