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Photolithography
This process transfers the circuit pattern on an original plate to a wafer.
Photolithography is a fundamental process in semiconductor manufacturing which is creating intricate patterns on semiconductor wafers. The process begins with a semiconductor wafer coated with a light-sensitive material called photoresist. A photomask, containing the desired circuit pattern, is placed in the light path to the wafer. The combination of the photomask and the wafer is exposed to ultraviolet (UV) light. This exposure selectively alters the photoresist's chemical properties, creating a patterned mask on the wafer that mirrors the design on the photomask. The wafer then undergoes development, where the exposed or unexposed portions of the photoresist are selectively removed, revealing the desired pattern.
Wafer edge exposure
Wafer edge exposure process removes unnecessary resist around the wafer. Leveraging a diverse array of UV light sources facilitates highly efficient and precise removal of resist.
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This spot type UV-LED light source has four heads independently driven. The palm-sized compact design allows for flexible design, such as installation in a small space.
Emission wavelength monitor
The UV-sensitive image sensors contribute to the efficiency and accuracy of the emission wavelength monitor, enabling real-time monitoring and adjustments. By ensuring that the light source maintains the desired wavelength, semiconductor manufacturers can enhance the reproducibility and reliability of the lithographic processes, ultimately leading to the production of high-quality semiconductor devices.
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This FFT-CCD area image sensor is for measurement applications, and developed for faint light detection. The image sensor has low noise, low dark current and wide dynamic range, enabling faint light detection by increasing the integration time.
A wide range of products are available according to wavelength and purpose of use, including types with high sensitivity in the ultraviolet and near-infrared regions and types with high resistance to ultraviolet irradiation.
Common process steps across semiconductor manufacturing
Optical critical dimension (OCD) measurement
Unlock unparalleled precision in semiconductor manufacturing with Hamamatsu's optical critical dimension (OCD) measurement solutions. Explore our advanced technologies tailored for accurate and reliable measurement of critical dimensions in nanoscale structures. Discover how Hamamatsu is reshaping the landscape of OCD measurement, delivering cutting-edge solutions for superior quality and performance in semiconductor fabrication processes.
Electrostatic charge removal (ESD)
Explore Hamamatsu's meticulously engineered electrostatic charge removal solutions, designed to enhance reliability across various processes. Our technology efficiently removes charges that could potentially damage the wafer, ensuring high-quality processes.
Wafer alignment
Elevate semiconductor manufacturing with Hamamatsu's solutions for wafer alignment. Our technologies are designed for accurate wafer positioning, enhancing efficiency and yield in semiconductor production. Discover how we are helping wafer alignment, delivering unparalleled reliability and performance for your semiconductor processing needs.
Inspection for particle contamination and surface defects
Ensure pristine semiconductor production with Hamamatsu's advanced wafer inspection for contaminates solutions. Discover our sophisticated technologies meticulously crafted for accurate contaminant detection, safeguarding semiconductor wafers from impurities. Explore how Hamamatsu's expertise in wafer inspection sets the standard for reliability and quality in semiconductor manufacturing processes.
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