半導体故障解析装置 半導体故障解析装置

参考文献 | 半導体故障解析装置

参考文献

アプリケーション タイトル 著者 書名
TD Imaging Application of Visible ThermoDynamic Imaging Technology for Hotspot Detection in Failure Analysis Shimpei Tominaga; Norimichi Chinone; Akihito Uchikado; Yuhei Aoshima; Tomonori Nakamura; Toru Matsumoto; Yunki Jung; Sungho Lee; Sangmin Han; Hyeongki Kim; Masataka Ikesu istfa2024p0242, pp. 242-247; 6 pages
TD Imaging High Resolution Thermal Imaging of Si Device by Near-Infrared Thermo-Reflectance and Separation of Thermal/Electro-Optical Mixed Signals by Means of Bias Dependency Norimichi Chinone; Shota Nozue; Shimpei Tominaga; Yuhei Aoshima istfa2025p0569, pp. 569-572; 4 pages
TD Imaging Application of NAND FLASH Failure Analysis Using Visible Thermo Reaction YunKi Jung; HyeongKi Kim; SangMin Han; SungHo Lee; NaKyeong Lee; YoungBin No; Byeongseon Choi; Akihito Uchikado; JungHoon An istfa2025p0495, pp. 495-499; 5 pages
TD Imaging Thermoreflectance mapping observation of Power MOSFET under UIS avalanche breakdown condition Koichi Endo, Kenji Norimatsu, Tomonori Nakamura, Takashi Setoya, Koji Nakamae MR-11580; No of Pages 6
TD Imaging Thermal behavior analysis of interconnect structures of Si semiconductor devices using the temperature dependent reflectance of an incoherent light beam Koichi Endo, Yoshihiro Midoh, Tomonori Nakamura, Toru Matsumoto, Kazushige Koshikawa and Koji Nakamae Jpn. J. Appl. Phys. 57 07ME02
TD Imaging Innovative Thermal Approaches to Fault Isolation in 3D Semiconductor Structures Norimichi Chinone and Shimpei Tominaga EDFA Magazine, Vol 27, No. 4, 2025, pp.4-11
TD Imaging Ultra-High Speed/High Timing-Resolution Electro-Optic Probing Using Streak Camera Xiangguang Mao; Tomonori Nakamura; Kenta Nakamura; Akari Kato; Mitsuyoshi Yoneda; Takayoshi Kaneoka; Fuminori Niikura; Ayumu Yoshimi istfa2025p0119, pp. 119-121; 3 pages

製品の購入やさらに詳しい情報についてはお問い合わせください。

  • 資料請求
  • 価格
  • 納期
  • カスタマイズ
  • デモ依頼
  • サポート
  • その他

お問い合わせ

お問い合わせ内容によっては、回答にお時間をいただく場合やお答えできない場合がございますので、あらかじめご了承ください。